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January 2007 rev 1.1 Four Output PCI-X and General Purpose Buffer
Features Functional Description
* * * * * * One input to four Output Buffer/Driver General-purpose or PCI-X clock buffer Buffers all frequencies from DC to 140 MHz Output-to-output skew less than 100 pS Available in 8-pin TSSOP and SOIC Packages 3.3V operation
ASM2P2304NZ
The ASM2P2304NZ is a low-cost buffer designed to distribute high-speed clocks for PCI-X and other applications. The device operates at 3.3V and outputs can run up to 140 MHz.
Table 1. Function Table. Inputs BUF_IN
L H L H
Outputs OE
L L H H
Output [1:4]
L L L H
Block Diagram
OE
Logic Control
BUF_ IN OUTPUT 1
OUTPUT 2
OUTPUT 3
OUTPUT 4
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 * Tel: 408-879-9077 * Fax: 408-879-9018 www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
January 2007 rev 1.1
Pin Configuration
BUF_IN 1 OE 2 OUTPUT 1 3 GND 4 8 OUTPUT 4 7 OUTPUT 3
ASM2P2304NZ
ASM2P2304NZ
6 VDD 5 OUTPUT 2
Pin Description Pin #
1 2 3 4 5 6 7 8
Notes : 1. 2.
Pin Name
BUF_IN OE Output 12 GND Output 2 VDD Output 3 Output 4
2 2 2 1
Type
I I O P O P O O
Description
Input clock. 5V Tolerant Input Input pin for Output Enable, active HIGH. Connect to VDD Output 1 Ground Output 2 3.3V Voltage Supply Output 3 Output 4
Weak pull down on input Weak pull down on all outputs
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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January 2007 rev 1.1
Absolute Maximum Ratings Parameter
Supply Voltage to Ground Potential DC Input Voltage (Except BUF_IN) DC Input Voltage (BUF_IN) Storage Temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B)
ASM2P2304NZ
Description
-0.5 -0.5 -0.5 -65
Min
7 VDD + 0.5 7 +150 260 150 2000
Max
V V V C C C V
Note: These are stress ratings only and functional usage is not implied. Exposure to absolute maximum ratings for prolonged periods can affect device reliability.
Operating Conditions Parameter
VDD TA CL CIN BUF_IN, OUTPUT [1:4] tPU Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance Input Capacitance Operating Frequency Power-up time for all VDD's to reach minimum specified Voltage (Power ramps must be monotonic)
Description
Min
3.0 -40 DC 0.05
Max
3.6 85 25 7 140 50
Unit
V C pF pF MHz mS
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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January 2007 rev 1.1
Electrical Characteristics Parameter
VIL VIH IIL IIH
ASM2P2304NZ
Description
Input LOW Voltage1 Input HIGH Voltage1 Input LOW Current Input HIGH Current Output LOW Voltage2
Test Conditions
Min
2.0
Max
0.8 5 12 0.8 0.55 25
Unit
V V A A V V V V mA
VIN = 0V VIN= VDD IOL= 24 mA IOL= 12 mA
-5 -5 2.0 2.4 -
VOL
VOH
Output HIGH Voltage2
IOH= -24 mA IOH= -12 mA
IDD
Supply Current
Unloaded outputs at 66.66 MHz
Switching Characteristics for Commercial and Industrial Temperature Devices3 Parameter
tD t3 t4 t5 t6
Name
Duty Cycle2 = t2 /t1 Rise Time2 Fall Time2 Output to Output Skew2 Propagation Delay, BUF_IN Rising Edge to OUTPUT Rising Edge2
Description
Measured at 1.5V Measured between 0.8V and 2.0V Measured between 2.0V and 0.8V All outputs equally loaded For Commercial parts For Industrial parts
Min
40.0 2.5
Typ
50.0 3.5
Max
60.0 1.50 1.50 100 150 5
Unit
% nS nS pS nS
Measured at VDD/2
Note: 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 3. All parameters specified with loaded outputs.
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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January 2007 rev 1.1
Switching Waveforms Duty Cycle Timing
ASM2P2304NZ
All Outputs Rise/Fall Time
Output-Output Skew
Input-Output Propagation Delay
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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January 2007 rev 1.1
Package Information
ASM2P2304NZ
8-lead Thin Shrunk Small Outline Package (4.40-MM Body)
H
E D A2 A e B A1 L C
Dimensions Symbol Min
A A1 A2 B c D E e H L 0.020 0 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8 0.50 0
Inches Max
0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30
Millimeters Min Max
1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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January 2007 rev 1.1
Package Information 8-lead (150-mil) SOIC Package
ASM2P2304NZ
E
H
D
A2
A
e B A 1
C L
D
Dimensions
Symbol Min
A1 A A2 B C D E e H L
Inches Max
0.010 0.069 0.059 0.020 0.010 0.004 0.053 0.049 0.012 0.007
Millimeters Min Max
0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0 1.27 8 0.25 1.75 1.50 0.51 0.25
0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0 0.050 8
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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January 2007 rev 1.1
Ordering Codes Part Number
ASM2P2304NZF-08-ST ASM2P2304NZF-08-SR ASM2I2304NZF-08-ST ASM2I2304NZF-08-SR ASM2P2304NZG-08-ST ASM2P2304NZG-08-SR ASM2I2304NZG-08-ST ASM2I2304NZG-08-SR ASM2P2304NZF-08-TT ASM2P2304NZF-08-TR ASM2I2304NZF-08-TT ASM2I2304NZF-08-TR ASM2P2304NZG-08-TT ASM2P2304NZG-08-TR ASM2I2304NZG-08-TT ASM2I2304NZG-08-TR
ASM2P2304NZ
Marking
2P2304NZF 2P2304NZF 2I2304NZF 2I2304NZF 2P2304NZG 2P2304NZG 2I2304NZG 2I2304NZG 2P2304NZF 2P2304NZF 2I2304NZF 2I2304NZF 2P2304NZG 2P2304NZG 2I2304NZG 2I2304NZG
Package Type
8-pin SOIC - Tube, Pb Free 8-pin SOIC - Tape and Reel, Pb Free 8-pin SOIC - Tube, Pb Free 8-pin SOIC - Tape and Reel, Pb Free 8-pin SOIC - Tube, Green 8-pin SOIC - Tape and Reel, Green 8-pin SOIC - Tube, Green 8-pin SOIC - Tape and Reel, Green 8-pin TSSOP - Tube, Pb Free 8-pin TSSOP - Tape and Reel, Pb Free 8-pin TSSOP - Tube, Pb Free 8-pin TSSOP - Tape and Reel, Pb Free 8-pin TSSOP - Tube, Green 8-pin TSSOP - Tape and Reel, Green 8-pin TSSOP - Tube, Green 8-pin TSSOP - Tape and Reel, Green
Temperature
Commercial Commercial Industrial Industrial Commercial Commercial Industrial Industrial Commercial Commercial Industrial Industrial Commercial Commercial Industrial Industrial
Device Ordering Information
ASM2P2304NZ
F-08-TR
R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70
PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved
PulseCore Semiconductor Mixed Signal Product
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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January 2007 rev 1.1
ASM2P2304NZ
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com
Copyright (c) PulseCore Semiconductor All Rights Reserved Part Number: ASM2P2304NZ Document Version: 1.1
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003
(c) Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore's best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore's Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore's Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Four Output PCI-X and General Purpose Buffer
Notice: The information in this document is subject to change without notice.
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